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Partnership with world class Fab., and packaging / Test manufacturers
Foundries:
- Strong Relationship with major semiconductor Foundries:
- NEC Semiconductor Corp.
- UMC
- TSMC
- Samsung
Test & Packaging:
- ASAT
- ASE
The ASE Group provides an extensive array of products. ASE provides the most complete, fully integrated services in the industry. This enables our customers to conduct total cost management and enjoy greater flexibility in both forward and backward integration.
ASE, the leading IC packaging company in the world, provides versatile and confident services, from the conventional PTH (plated-through-hole) packaging to flip-chip BGAs with over 1500 I/O BGA
- Thermally Enhanced BGAs, Flip Chip BGAs
- Low and Thin BGAs
- Multi-Chip Modules (MCM)
- Dual-in-Line Packages (TSSOP and TQFP)
- QUAD Packages
- CSP
Customer Preferred I.C. manufacturers
- In addition to LDIC's partnership in partner program, LDIC is able to complete the qualification process of the customers preferred I.C. manufacturer, enabling customer to freely select their own preferred fab.
Customer's own I.C. Fab.
- In the past we have worked with some world class manufacturer that have their own fab, LDIC has been able to design to customer's own fab, providing the freedom to leverage the cost.
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